A Process Simulation Model for Silicon Ion Implantation in Undoped, LEC‐Grown GaAs

The activation efficiency of implanted Si in LEC grown has been investigated experimentally. Atomic and carrier distributions of the implant have been obtained using SIMS, conventional, and step‐etch C‐V techniques, respectively. Based on these experimental observations, Si activation efficiency is found to be a strong function of the implantation fluence and annealing temperature, and a weak function of the implantation energy and annealing time. An activation efficiency model is also constructed as the result of these experimental evaluations. For simplicity the model ignores all the weak processing parameters in the computation of activation efficiency. A model reproducing the atomic concentration profile for a given implant has also been developed to use in the activation efficiency model.