Skip to content
RDL
Network
Ecosystem
Switch app
TR
About
FAQ
Sign in
Get started
Mission-profile-based stress analysis of bond-wires in SiC power modules (2016) | RDL Network
Back
Cite
Save
Save for later
Share
Home
Publications
Mission-profile-based stress analysis of bond-wires in SiC power modules
Shared by
Frede Blaabjerg
Aalborg University
Mission-profile-based stress analysis of bond-wires in SiC power modules
Article
2016
en
Related publications
Article
2013
Mission profile based multi-disciplinary analysis of power modules in single-phase transformerless photovoltaic inverters
Article
2017
Separation test method for investigation of current density effects on bond wires of SiC power MOSFET modules
Article
2019
A Viable Mission Profile Emulator for Power Modules in Modular Multilevel Converters
Discussion
(0)
Sign in
to like and join the discussion.
No comments yet. Be the first to comment.
Article
2018
Mission Profile Based Power Converter Reliability Analysis in a DC Power Electronic Based Power System
Article
2013
Real field mission profile oriented design of a SiC-based PV-inverter application
Discussion(0)
No comments yet. Be the first to comment.