MEMS-Electronic-Photonic Heterogeneous Integrated FMCW Ladar Source

Abstract : The goal of this project is to develop a modular, heterogeneous integration process to combine III-V tunable VCSELs, silicon photonic integrated circuits, and CMOS ICs in a seamless manner, and demonstrate a single-chip FMCW (Frequency-Modulated Continuous-Wave) LADAR source. In Phase 2, we have successfully developed through-silicon-vias (TSVs) on Si photonics at wafer level, and stacking the Si photonic dies on top of CMOS at die level. Electrical and mechanical properties of the bonded systems were characterized. FPGA and CMOS programming using a custom graphical user interface have been implemented, and optical and electrical interfacing to the system has been achieved.