Heterogeneous integration of silicon photonic devices and integrated circuits

Hyundai Park; Brian R. Koch; Erik Norberg; Jonathon E. Roth; Byungchae Kim; Anand Ramaswamy; John W. Hutchinson; JaeHyuk Shin; G.A. Fish

doi:10.1109/cleopr.2015.7375925

Abstract

1 min read

Aurrion's heterogeneous integration platform enables simultaneous integration of active and passive photonic components on a silicon substrate. The platform provides photonic device library where each component is tailored to deliver maximum functionality for large scale photonic integrated circuits.

Related publications

Article2014

Heterogeneously integrated lasers on silicon

Brian R. Koch, Erik Norberg, Jonathan E. Roth, Byungchae Kim, Anand Ramaswamy, Robert S. Guzzon, John W. Hutchinson, JaeHyuk Shin, Jeffrey T. Imamura, Brandon Gomez, G.A. Fish, Alexander W. Fang

Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

Article2014

Heterogeneous Integration on Silicon

Alexander W. Fang, Brian R. Koch, Erik Norberg, Jonathon E. Roth, Byungchae Kim, Anand Ramaswamy, John W. Hutchinson, JaeHyuk Shin, G.A. Fish

Article2016

Heterogeneous integration of III–V on silicon for system-in-package photonic transceivers

G.A. Fish, Brian R. Koch, Erik Norberg, Jonathon E. Roth, Anand Ramaswamy, John W. Hutchinson, JaeHyuk Shin, Alexander W. Fang

International Semiconductor Laser Conference

Article2015

Development of an FMCW LADAR Source Chip using MEMS-Electronic-Photonic Heterogeneous Integration

MingC . Wu, Niels Quack, James Ferrara, Simone Gambini, Seung-Hoon Han, Christopher Lalau Keraly, Pengfei Qiao, Yi Rao, Phillip A. M. Sandborn, Ling Zhu, S. L. Chuang, Eli Yablonovitch, Bernhard E. Boser, Constance J. Chang-Hasnain

Article2025

Low-Thermal-Budget Excimer-Laser Crystallization of Hf 0.5 Zr 0.5 O 2 with UV-Transparent Dielectric Capping: A Unified Platform for BEOL and Oxide-TFT Backplanes

D.H Kim, Ho Won Jang