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Low-Dielectric Constant SiO(F,C) Films for ULSI Interconnections Prepared by CF<sub>4</sub> Plasma Ion Implantation — Yuanzhong Zhou (1998) | RDL Network
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Low-Dielectric Constant SiO(F,C) Films for ULSI Interconnections Prepared by CF<sub>4</sub> Plasma Ion Implantation
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Paul Kim Ho Chu
Low-Dielectric Constant SiO(F,C) Films for ULSI Interconnections Prepared by CF<sub>4</sub> Plasma Ion Implantation
Article
1998
en
Authors
+1 more
YZ
Yuanzhong Zhou
SQ
Shu Qin
CC
Chung Chan
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