Electro-thermal co-simulation of two parallel-connected SiC-MOSFETs under thermally-imbalanced conditions
2022 IEEE Applied Power Electronics Conference and Exposition (APEC): 2855-2860
Article 2018 English
Authors
YM
Yasushige Mukunoki
TH
Takeshi Horiguchi
AN
Akinori Nishizawa
Abstract
1 min read
This paper describes electro-thermal co-simulation of two parallel-connected SiC-MOSFETs using a temperature-dependent compact model for a discrete SiC-MOSFET. The temperature-dependent compact model is constructed on the basis of the previous model with appropriate-modification of output characteristics and threshold voltage. This compact model also gives the accurate reproducibility of the transient waveforms in a high region of drain current. The current sharing simulation between the parallel-connected SiC-MOSFETs under thermally-imbalanced conditions is experimentally verified. Based on the above verification, the electro-thermal co-simulation in a boost chopper is conducted, which successfully shows the junction temperature distribution between the two SiC-MOSFETs.
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