Design, Synthesis, and Characterization of Carbon-Rich Cyclopolymers for 193 nm Microlithography

A series of cyclopolymers designed for use in 193 nm photoresist materials has been synthesized and characterized. These novel materials that provide both optical transparency at 193 nm and also reactive ion etch resistance are obtained via cyclopolymerization of suitably designed bifunctional monomers incorporating acrylic and olefinic double bonds. The approach is highly versatile and allows the preparation of a broad array of structurally related materials with different substituents providing the imaging function and the desired level of etch resistance. The cyclopolymerization process is experimentally forgiving, enabling control of the molecular weight as well as the incorporation of comonomers such as acrylic acid or maleic anhydride to fine-tune the lithographic properties.