Skip to content
RDL
Network
Ecosystem
Switch app
TR
About
FAQ
Sign in
Get started
Comparative Analysis of Bond Wire Degradation in Power Modules During DC and AC Power Cycling (2024) | RDL Network
Back
Cite
Save
Save for later
Share
Home
Publications
Comparative Analysis of Bond Wire Degradation in Power Modules During DC and AC Power Cycling
Shared by
Frede Blaabjerg
Aalborg University
Comparative Analysis of Bond Wire Degradation in Power Modules During DC and AC Power Cycling
Article
2024
en
Related publications
Article
2020
Separation of Bond-Wire and Solder Layer Failure Modes in IGBT Power Modules
Article
2019
Study of Current Density Influence on Bond Wire Degradation Rate in SiC MOSFET Modules
Article
2017
Die degradation effect on aging rate in accelerated cycling tests of SiC power MOSFET modules
Discussion
(0)
Sign in
to like and join the discussion.
No comments yet. Be the first to comment.
Article
2018
Solder layer degradation measurement for sic-MOSFET modules under accelerated power cycling conditions
Article
2017
Aging precursors and degradation effects of SiC-MOSFET modules under highly accelerated power cycling conditions
Discussion(0)
No comments yet. Be the first to comment.