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a.c. Electrolytic graining or electrograining employs an alternating voltage or current on aluminium electrodes in a suitable electrolyte, e.g. hydrochloric or nitric acid, to produce uniformly pitted and convoluted surfaces for lithography. The resultant morphology or the electrograined surface is dependent upon the particular electrical, solution and substrate conditions employed. Here, current understanding of electrograining of aluminium in hydrochloric acid is reviewed and compared with graining in nitric acid. Electron micrographs revealed that during electrograining large hemispherical pits are formed in both electrolytes. However, close examination of the hemispherical pits formed in hydrochloric acid showed that they are composed of a large number of fine cubic pits. Conversly, these crystallographic pits are not observed after treatment in nitric acid; instead a hemispherical pit with a characteristic dimension is found. Such morphological appearances have been studied as a function of graining frequency and current density. In addition to the formation of pits, a non-uniform film of etch products is formed, masking completely the real surface morphology. This etch film is deposited largely as a gel of water and amorphous Al(OH)3, aluminium particles and some chloride or nitrate ions. The formation of this etch film is explained by a cathodic filming process on the aluminium electrode. Surface alterations by treatment in both electrolytes are explained in terms of the applied a.c. signal.
Bubble evolution during AC-graining is analysed in combination with the variation of the anodic peaks of the potential and the electrode surface morphology. Aluminium samples are grained in hydrochloric acid in an Inverted Rotating Disk Electrode. A roughness tester is used to characterise the electrode surface, while shadow imaging is applied to determine the bubble size distribution. An interpretation of the correlation existing among bubble size, potential peaks evolution, surface properties and smut layer formation is proposed, which provides insights into the mechanisms involved in bubble formation.
SUMMARYThis paper focuses on the comparison of ac electrograining of aluminium in hydrochloric and nitric acid. Several aspects are considered: the final morphology obtained as a function of the current density and the acid concentration for both systems, the development of the morphology as a function of the applied charge density, the formation of the etch products and the anodic current response obtained in the acid solutions containing chloride or nitrate anions. It is concluded that for both systems, in a current density—acid concentration diagram three different regions with characteristic morphologies can be recognised. Some remarkable differences are noted between the two systems. At relatively high concentrations, hydrochloric acid leads to a highly deep-etched surface while more unattacked surface areas are obtained in nitric acid. The development of the morphology as a function of the applied charge, the current density and the acid concentration is very complex and different for the two systems. Convection has an effect on the location of the regions of the different morphologies, meaning that the reactor type may have a major influence on the graining morphology obtained. Electrochemical measurements, represented in the form of anodic chronoamperometric diagrams, show that the basic mechanism of anodic pitting is different for the two types of anions.
The application of alternating current to aluminium in hydrochloric acid electrolyte results ultimately in the formation of a high density of hemispherical pits, which merge to produce a relatively uniformly pitted and convoluted surface topography. Through variation of the electrograining frequency and anodic or cathodic charge, it is evident that the hemispherical pits propagate through the development of a high population density of cubic pits on the positive half-cycle, which form the wall of the hemispherical pit. The size of the cubic pits decreases with increase in frequency, leading to relatively smooth hemispherical pits. On the negative half-cycle, etch products deposit as highly porous hydrated alumina over the relatively uniformly pitted aluminium surface.
For corrosion and adhesion problems, the aluminium and its alloys are usually modified by different surface treatments. Silane coupling agents that are an alternative treatment for the chromate‐containing pretreatment are being used more frequently in industry. This paper focuses on the study of a no‐rinse system using the non‐functional silane bis‐1,2‐(triethoxysilyl)ethane (BTSE). The objective of this work is to study the effect of curing BTSE films coated on aluminium substrates. Spectroscopic ellipsometry is used to determine the thickness and optical constants of the silane coatings as a function of the curing conditions. It is shown by infrared spectroscopic ellipsometry (IRSE) how the curing causes changes in the chemistry of silane films deposited on aluminium. Indeed, IRSE combines the advantages of the traditional Fourier transform infrared spectroscopy method (molecular information via knowledge of the infrared absorption bands) with those of spectroscopic ellipsometry (morphological information such as film thickness and optical information such as refractive index and extinction coefficient). Copyright © 2002 John Wiley & Sons, Ltd.