The local electrochemical reactivity of high purity copper as a function of the grain orientation in the microstructure has been investigated. The different crystal orientations were determined by means of Electron backscatter diffraction (EBSD) followed by in-situ Scanning electrochemical microscopy (SECM) measurements operating in feedback mode across the very same copper surface. With this procedure it is possible to characterize in-situ the reactivity of selected grains in the polycrystalline microstructure of the copper. The study is focused on monitoring differences in the electrochemical response on <001>//ND and <111>//ND oriented grains. The behaviour of these selected orientations was studied under two surface conditions: passive state of copper after the formation of an anodic oxide layer, and corrosion or active state of the copper by immersion in chloride solution. In the case of the passivated copper it was observed that the grain with an orientation closer to <111>//ND shows a lower reactivity compared to the grain where the orientation is nearer to <001>//ND, which confirmed that grain orientation has an influence on the electrochemical reactivity of the passive layer formed on the metal. It was found that for the copper in the active state, the reactivity of a <111>//ND oriented grain is higher when compared to a <001>//ND oriented grain, which is contrary to the expected behaviour. This discrepancy could be explained by possible neighbouring effects between both grains.
SUMMARYThe effect of AC-electrochemical cleaning on rolled AA1050 and AA5182 is investigated in sulphuric and phosphoric acid under constant AC-current conditions. Potential response and oxide thickness measurements demonstrate the difference between AC-cleaning and AC-anodising The roles of the anodic and cathodic charge cycles in creating the cleaned surface features are studied. For AA1050 no contribution of the cathodic hydrogen evolution reaction is witnessed, while for AA5182 an extra metal loss due to the reduction process is apparent. The cleaned surface is covered with a thin oxide layer (<20 nm). Scanning electron micrographs show a rough and cratered surface after AC-cleaning in phosphoric acid. The surface roughening is less severe in sulphuric acid. No etchfilm formation is observed; the oxidised aluminium is removed from the substrate into the solution. The AC-cleaning is more efficient in terms of metal loss (10 to 100 times faster in respectively sulphuric and phosphoric acid) than the traditional acid etching.
Porous anodic oxide films on aluminium formed in phosphoric acid (PAA) have been characterized nondestructively by spectroscopic ellipsometry. Compared to previous studies on porous films formed in sulfuric acid, the optical behaviour of PAA films reveals new features which have been attributed to film-substrate interface roughness and optical anisotropy effects. On one hand relatively large interface roughness has been simulated by a graded index model. On the other hand, the implementation of uniaxial anisotropy in the optical model of the PAA film enables to interpret spectroscopic ellipsometry data acquired at multiple angles of incidence in terms of the morphology of the films. More specifically, accurate and physically realistic values are found for the porosity and porous film thickness. Although more difficult to interpret from the optical findings, the thickness of the barrier part of the porous film can also be estimated. The ellipsometry characterizations are confirmed by complementary TEM analysis of various films. Finally, the anisotropy exhibited by the PAA films is in line with recent theoretical predictions of the optical behaviour of arrays of parallel cylindrical capillaries in an isotropic medium proposed by other authors.
In this research we aim to present a fast and semi-quantitative electrochemical method – based on cyclic voltammetry (CV) – to easily screen the H uptake of materials. We used Aermet 100, an ultrahigh-strength steel, in its as-quenched (martensitic) state and an aged state to investigate the H-desorption properties of different microstructures. The CV-based method clearly shows the influence of the alloying elements, the microstructure and the effect of hydrogen recombination poisons on the H uptake. The experiments indicate that a significant part of the uptake of hydrogen is due to (i) the presence of Ni as an alloying element and (ii) the presence of austenite that forms during the heat treatment.
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SummaryThe roughening of aluminium lithographic sheet is most commonly carried out by a.c. electrolytic graining. An electrochemical investigation of the mechanism of the anodic electrode processes involved in the electrograining of aluminium is presented. The role of the anodic processes in the development of a distinct surface morphology is established. The investigation involves potential step experiments in a dedicated wall-jet electrode reactor, allowing the mechanism of the oxidation of aluminium during the a.c. electrolytic graining to be investigated in a hydrodynamic steady state. Moreover, the role of mass transport in the overall kinetics of the electrode processes can be determined. For the analysis of the potentiostatic transient behaviour, a numerical computational method is presented, based on a second-order-correct implicit finite difference approach.
No abstract is provided for this article.
No abstract is provided for this article.
The introduction of adhesive bonding in the automotive industry is one of the key enabling technologies for the production of aluminium closures and all-aluminium car body structures. One of the main concerns limiting the use of adhesive joints is the durability of these system when exposed to service conditions. The present article primarily focuses on the different research works carried out for studying the effect of water, corrosive ions and external stresses on the performances of adhesively bonded joint structures. Water or moisture can affect the system by both modifying the adhesive properties or, more importantly, by causing failure at the substrate/adhesive interface. Ionic species can lead to the initiation and propagation of filiform corrosion and applied stresses can accelerate the detrimental effect of water or corrosion. Moreover, in this review the steps which the metal undergoes before being joined are described. It is shown how the metal preparation has an important role in the durability of the system, as it modifies the chemistry of the substrate’s top layer. In fact, from the adhesion theories discussed, it is seen how physical and chemical bonding, and in particular acid-base interactions, are fundamental in assuring a good substrate/adhesive adhesion.