Patterning of graphene on silicon-on-insulator waveguides through laser ablation and plasma etching
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE 9891: 98910T-98910T
Article 2016 English
Authors
JE
Jürgen Van Erps
TC
Tymoteusz Ciuk
IP
Iwona Pasternak
Abstract
1 min read
We present the use of femtosecond laser ablation for the removal of monolayer graphene from silicon-on-insulator (SOI) waveguides, and the use of oxygen plasma etching through a metal mask to peel off graphene from the grating couplers attached to the waveguides. Through Raman spectroscopy and atomic force microscopy, we show that the removal of graphene is successful with minimal damage to the underlying SOI waveguides. Finally, we employ both removal techniques to measure the contribution of graphene to the loss of grating-coupled graphene-covered SOI waveguides using the cut-back method. This loss contribution is measured to be 0.132 dB/μm.
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