Abstract Die Reaktion der Organokupferverbindung (I), die aus einer Norbornan‐ Grignardverbindung und einem Bromophosphin‐kupfer‐Komplex in guter Ausbeute dargestellt wurde, mit dem Cu‐Deuterid (II) zu dem Norbornan (III) wurde ausgeführt, um ein Modell für die Reaktivität von Übergangsmetallhydriden und Organoübergangsmetallverbindungen zu erhalten.
The mechanics of crack tip plasticity in dynamic crack growth is considered as it influences two modes of dynamic fracture—cleavage and micro-void nucleation, growth and coalescence. The subject is approached using both the continuum theory of visco-plasticity and dislocation dynamics. The viewpoint underlying each approach is that the crack is traveling through material with a relatively high density of pre-existing mobile dislocations. Analysis is directed at discovering the role played by the associated rate-dependent plasticity in establishing conditions for dynamic crack propagation. The theory is far from complete, but the contents of the paper should serve to aid understanding of basic material fracture phenomena, such as cleavability and the ductile-brittle transition, as well as provide a background for the engineering theory of dynamic fracture.
No abstract is provided for this article.
A solution is presented for the elastic stress intensity factors at the tip of a slightly curved or kinked two-dimensional crack. The solution is accurate
Despite the extraordinary success of current techniques for microfabrication, new techniques are needed. One reason is scale: optically based lithography is reaching the lower limits for the size of features it can produce (˜100 nm). Another is efficiency: methods such as electron beam lithography are presently linear processes and will require significant development if they are to be used for large scale, high volume processing. Other considerations such as capital and processing costs, waste management, environmental concerns, and the degree of perfection of the final structures may also force the development of new methods for microfabrication.