Skip to content
RDL
Network
Ekosistem
Uygulama değiştir
EN
Hakkımızda
SSS
Giriş yap
Başla
Wear-out failure of an IGBT module in motor drives due to uneven thermal impedance of power semiconductor devices (2020) | RDL Network
Back
Cite
Save
Save for later
Share
Home
Publications
Wear-out failure of an IGBT module in motor drives due to uneven thermal impedance of power semiconductor devices
Shared by
Frede Blaabjerg
Aalborg University
Wear-out failure of an IGBT module in motor drives due to uneven thermal impedance of power semiconductor devices
Article
2020
en
Related publications
Article
2018
Prediction and Validation of Wear-Out Reliability Metrics for Power Semiconductor Devices With Mission Profiles in Motor Drive Application
Article
2019
Wear-Out Condition Monitoring of IGBT and mosfet Power Modules in Inverter Operation
Article
2017
Separation of Wear-Out Failure Modes of IGBT Modules in Grid-Connected Inverter Systems
Discussion
(0)
Sign in
to like and join the discussion.
No comments yet. Be the first to comment.
Article
2018
Wear-Out Failure Analysis of an Impedance-Source PV Microinverter Based on System-Level Electrothermal Modeling
Article
2015
Frequency-domain thermal modelling of power semiconductor devices
Discussion(0)
No comments yet. Be the first to comment.