Skip to content
RDL
Network
Ecosystem
Switch app
TR
About
FAQ
Sign in
Get started
Thermal resistance modelling and design optimization of PCB vias (2018) | RDL Network
Back
Cite
Save
Save for later
Share
Home
Publications
Thermal resistance modelling and design optimization of PCB vias
Shared by
Frede Blaabjerg
Aalborg University
Thermal resistance modelling and design optimization of PCB vias
Article
2018
en
Related publications
Article
2019
Thermal Modeling and Design Optimization of PCB Vias and Pads
Article
2019
Two-Dimensional Thermal Modeling and Parametric Optimization of Printed Circuit Board Vias
Book
1995
Thermal design and optimization
Adrian Bejan
Discussion
(0)
Sign in
to like and join the discussion.
No comments yet. Be the first to comment.
Book
1995
Thermal design and optimization
Adrian Bejan
Article
1996
Thermal design and optimization
Adrian Bejan
,
George Tsatsaronis
,
Michael J. Moran
Choice Reviews Online
Discussion(0)
No comments yet. Be the first to comment.