Skip to content
RDL
Network
Ekosistem
Uygulama değiştir
EN
Hakkımızda
SSS
Giriş yap
Başla
Surface energy and chemistry of ethylene-propylene-diene elastomer (EPDM) treated by plasma immersion ion implantation — Imad F. Husein (2002) | RDL Network
Back
Cite
Save
Save for later
Share
Home
Publications
Surface energy and chemistry of ethylene-propylene-diene elastomer (EPDM) treated by plasma immersion ion implantation
Shared by
Paul Kim Ho Chu
Surface energy and chemistry of ethylene-propylene-diene elastomer (EPDM) treated by plasma immersion ion implantation
Article
2002
en
Authors
IH
Imad F. Husein
CC
Chung Chan
Paul Kim Ho Chu
Discussion
(0)
Sign in
to like and join the discussion.
No comments yet. Be the first to comment.
Related publications
Article
2004
Surface composition and surface energy of Teflon treated by metal plasma immersion ion implantation
Ricky K.Y. Fu
,
Yongfeng Mei
,
Guojiang Wan
,
G. G. Siu
,
Paul Kim Ho Chu
,
Yimei Huang
,
X. B. Tian
,
Shiwei Yang
,
J.Y. Chen
Article
2003
Surface characterization and antibacterial adhesion of poly (ethylene terephthalate) modified by acetylene plasma immersion ion implantation
Jiannong Wang
,
Nan Huang
,
Sun Hong
,
F. Chen
,
Pei Fang Yang
,
Y.X. Leng
,
J.Y. Chen
,
G.J. Wang
,
Z.Y. Liu
,
Xiaohui Wu
,
Paul Kim Ho Chu
Article
2006
Investigation of cytocompatibility of surface-treated cellulose nitrate films by using plasma immersion ion implantation
Ka Fai Chan
,
Jeffery Ho
,
W.Y. Li
,
B.M.F. Lau
,
Anfernee Kai‐Wing Tse
,
W.F. Fong
,
Marcela Bilek
,
David R. McKenzie
,
Paul Kim Ho Chu
,
Kaiyuan Yu
Article
2005
Surface modification of polymeric materials by plasma immersion ion implantation
Ricky K.Y. Fu
,
I.T.L. Cheung
,
Yongfeng Mei
,
C.H. Shek
,
G. G. Siu
,
Paul Kim Ho Chu
,
Wenwu Yang
,
Y.X. Leng
,
Yimei Huang
,
X. B. Tian
,
Shiwei Yang
Article
2009
Comparison of oxidation resistance of copper treated by beam-line ion implantation and plasma immersion ion implantation
Quanzhang An
,
Liuhe Li
,
Tao Hu
,
Yunchang Xin
,
Ricky K.Y. Fu
,
Dixon T. K. Kwok
,
Xun Cai
,
Paul Kim Ho Chu
Discussion(0)
No comments yet. Be the first to comment.