System-in- Package (SiP) aims to integrate a functional subsystem, one or more semiconductor chips and passive components into a package, so as to realize a basically complete function. The power module based on system-in-package (SiP) has many structural and performance advantages, such as miniaturization, high heat dissipation, low impedance and so on, which fits the development trend of electronic packaging towards miniaturization and high performance. In this paper, the random vibration simulation analysis of a power module is carried out by using finite element simulation software, and the influence of random vibration load onto the stress on the micro bumps on the adapter board in the power module is studied, and the potential risk points are determined before the product manufacture, thus improving the product reliability, reducing the development cost and shortening the development cycle.
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