Quasi-1D edge contact to hBN-encapsulated multilayered graphene by SF6 dry etch

Ryuichi Tsuchikawa; David Castro; Swastik Ballav; Michael S. Lodge; Kenji Watanabe; Takashi Taniguchi; Masa Ishigami; Robert E. Peale

doi:10.1557/s43580-025-01276-x

Related publications

Article2024

hBN‐Encapsulated Graphene Coupled to a Plasmonic Metasurface via 1D Electrodes for Photodetection Applications

Christian Frydendahl, S.R.K. Chaitanya Indukuri, T. R. Devidas, Zhengli Han, Noa Mazurski, Kenji Watanabe, Takashi Taniguchi, Hadar Steinberg, Uriel Levy

Article2024

hBN‐Encapsulated Graphene Coupled to a Plasmonic Metasurface via 1D Electrodes for Photodetection Applications

Christian Frydendahl, S.R.K. Chaitanya Indukuri, T. R. Devidas, Zhengli Han, Noa Mazurski, Kenji Watanabe, Takashi Taniguchi, Hadar Steinberg, Uriel Levy

Article2019

High-temperature electronic devices enabled by hBN-encapsulated graphene

Makars Šiškins, Ciaran Mullan, Seok‐Kyun Son, Jun Yin, Kenji Watanabe, Takashi Taniguchi, Davit Ghazaryan, Konstantin ‘kostya’ Novoselov, Artem Mishchenko

Applied Physics Letters

Article2024

In situ via Contact to hBN-Encapsulated Air-Sensitive Atomically Thin Semiconductors

Hae Yeon Lee, Zhiying Wang, Grace Chen, Luke N. Holtzman, Xingzhou Yan, Jacob Amontree, Amirali Zangiabadi, Kenji Watanabe, Takashi Taniguchi, Katayun Barmak, Philip Kim, James Hone

Preprint2024

Charge pumping in hBN-encapsulated graphene driven by surface acoustic waves

Dublin M. Nichols, Jameson G. Berg, Takashi Taniguchi, Kenji Watanabe, Pallavi Dhagat, Vikram V. Deshpande, Albrecht Jander, Ethan D. Minot

Quasi-1D edge contact to hBN-encapsulated multilayered graphene by SF6 dry etch

Discussion(0)

Related publications

hBN‐Encapsulated Graphene Coupled to a Plasmonic Metasurface via 1D Electrodes for Photodetection Applications

hBN‐Encapsulated Graphene Coupled to a Plasmonic Metasurface via 1D Electrodes for Photodetection Applications

High-temperature electronic devices enabled by hBN-encapsulated graphene

In situ via Contact to hBN-Encapsulated Air-Sensitive Atomically Thin Semiconductors

Charge pumping in hBN-encapsulated graphene driven by surface acoustic waves