Piezocatalysis for Chemical–Mechanical Polishing of SiC: Dual Roles of t‐BaTiO3 as a Piezocatalyst and an Abrasive

Tao Hu; Jinxi Feng; Wen Yan; Shuanghong Tian; Jingxiang Sun; Xiaosheng Liu; Di Wei; Ziming Wang; Yang Yu; Jason Chun‐Ho Lam; Shaorong Liu; Zhong Lin Wang; Ya Xiong

doi:10.1002/smll.202310117

Abstract

1 min read

Chemical mechanical polishing (CMP) offers a promising pathway to smooth third-generation semiconductors. However, it is still a challenge to reduce the use of additional oxidants or/and energy in current CMP processes. Here, a new and green atomically smoothing method: Piezocatalytic-CMP (Piezo-CMP) is reported. Investigation shows that the Piezo-CMP based on tetragonal BaTiO

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Piezocatalysis for Chemical–Mechanical Polishing of SiC: Dual Roles of t‐BaTiO<sub>3</sub> as a Piezocatalyst and an Abrasive

Abstract

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Piezo–pyro–photoelectric effects induced coupling enhancement of charge quantity in BaTiO<sub>3</sub> materials for simultaneously scavenging light and vibration energies

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