In plasma immersion ion implantation, the sample is negatively biased and a plasma sheath forms. Ions are accelerated to the sample surface through this sheath. The electric field contours dictate the shape of the plasma sheath that wraps around corners and tends to be smoother and rounder than the surface topography, for instance, at a sharp corner. Our theoretical and experimental studies reveal ion flux focusing effects leading to lateral nonuniformity of the incident ion dose. Ion focusing occurs not only at the sample edge but also in the central region even for a planar sample (wafer). In this work, we numerically and experimentally investigate this ion focusing effect and ion dose nonuniformity. A simple geometric model is also presented in this letter to understand the mechanism. The results demonstrate that ion focusing originates from plasma sheath convergence that is time and space dependent. Consequently, multiple ion focusing may occur at different local sites when the target shape and processing parameters vary, and a small plasma sheath relative to the target is of paramount importance for uniform implantation.
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