To predict and evaluate the electrical performance of System-on-Wafer (SoW), a power delivery network (PDN) modeling method which integrates electromagnetic simulation and circuit analysis was proposed. The methodology involves three primary steps: First, the PDN was modularly decomposed, and the RLC parasitic parameters of each unit were extracted by combining electromagnetic field analysis and numerical calculation; Second, an equivalent circuit model is constructed based on the physical layout; Finally, the accuracy of model is verified through 3D full-wave simulation, followed by ADS-based investigations into AC noise sensitivity to operating frequency, current-source excitation waveform parameters, and on-chip decoupling capacitor density. Results demonstrate that the model’s self-impedance curve closely aligns with 3D full-wave simulation data. Voltage stability and AC noise improvements can be achieved through optimized frequency selection within specific operational ranges, current-source excitation adjustments (reduced static power consumption and increased duty cycle), and implementation of large-size on-chip decoupling capacitors.
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