Miniaturization Potential of Additive Manufactures 3D-MID Components Produced by Stereolithography

In this research, 3D Mechatronic Integrated Devices (3D-MID) components are fabricated using Stereolithography (SLA) 3D printing and laser direct structuring (LDS) technologies. A process flow for 3D-MID fabrication based on SLA technology is developed to explore the miniaturization potential of these components. The results demonstrates that electric circuits can be successfully formed on substrates printed with resin mixed with LDS additives, following the laser structuring and metallization processes. The introduction of vias and the use of different packaging types enables the circuit to be miniaturized, with a minimum distance of 150 µm between conductive tracks, and the usage of BGA surface-mounted devices. The 3D-MID components based on SLA 3D printing technology exhibit significant potential for miniaturization, not only facilitating the integration of complex circuits and high-precision wiring but also offering broad support for the development of miniaturized electronic devices and systems.