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Microstructure and mechanical properties of C/C composite/TC4 joint with inactive AgCu filler metal — Wei Guo (2015) | RDL Network
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Microstructure and mechanical properties of C/C composite/TC4 joint with inactive AgCu filler metal
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Paul Kim Ho Chu
Microstructure and mechanical properties of C/C composite/TC4 joint with inactive AgCu filler metal
Article
2015
en
Authors
+1 more
WG
Wei Guo
LW
Lin Wang
YZ
Ying Zhu
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