<title>Demonstration of a nanolithographic system using a self-assembled monolayer resist for neutral atomic cesium</title>

This paper describes the formation of nanometer-scale features in gold and silicon substrates. The features in gold were made by using a self-assembled monolayer (SAM) of nonanethiolate on gold as a resist damaged by neutral cesium atoms. A SAM resist of octyltrichlorosilane on silicon dioxide was used as a resist sensitive to cesium atoms in order to fabricate features in silicon. A silicon nitride membrane perforated with nm- and micrometers -scale holes was used to pattern the atomic beam. Etching transferred the pattern formed in the SAM layer into the underlying substrate. Features of < 100-nm size were etched into the gold and silicon substrates. Investigations of the reflectivity of samples of nonanethiolate on gold, exposed to the atomic beam without a mask and subsequently etched, revealed that the resist-etch system exhibited a minimum threshold dose of cesium for damage; at doses lower than approximately 3 monolayers, the damage was insufficient to allow penetration of the SAM by the etching solution. The threshold dose for damage of the octyltrichlorosilane SAM on silicon dioxide is under investigation.