Kinking of a Crack out of an Interface: Role of In‐Plane Stress

A crack lying in the interface between two brittle elastic solids can advance either by continued growth in the interface or by kinking out of the interface into one of the adjoining materials. This competition can be assessed by comparing the ratio of the energy release rates for interface cracking and for kinking out of the interface to the ratio of interface toughness to substrate toughness. The stress parallel to the interface, σ 0 , influences the energy release rate of the kinked crack and can significantly alter the conditions for interface cracking over substrate cracking if sufficiently large. This paper provides the dependence of the energy release rate ratio on the in‐plane stress. The nondimensional stress parameter which emerges is, σ 0 ( a / E * T i ) 1/2 , where a is the initial length of the kink into the substrate, E * is a modulus quantity, and T i is the fracture energy of the interface. An experimental observation of the cracking of reaction product layers in bonds between Ti(Ta) and Al 2 O 3 is rationalized by the theory.