Grain boundary passivation studied by in situ scanning tunneling microscopy on microcrystalline copper
Journal of Solid State Electrochemistry 19(12): 3501-3509
Article 2015 English
Authors
HC
Hu Chen
VM
Vincent Maurice
LK
Lorena H. Klein
Abstract
1 min read
Electrochemical scanning tunneling microscopy (ECSTM) was applied to analyze in situ the passivation of grain boundaries on microcrystalline copper in 0.1&
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