Geometric Optimization of Cooling Techniques

In the design of packages of electronic components there are strong incentives to mount as much circuity as possible in a given space. This can be achieved by judiciously selecting the geometry of the package, i.e., the way in which the components are arranged relative to the coolant and to each other in the fixed space. In the electronics industry there is a great diversity of components, packages, and cooling techniques. The chapter systematically reviews the progress made in the newly emerging field of Geometric Optimization of Cooling Techniques. The only degree of freedom in choosing the best cooling arrangement is the position of the heated plate inside the channel. Microelectronics packaging is subject to several conflicting requirements such as electromagnetic compatibility, acoustic limits, and adequate cooling. The optimization of the spacing between boards with discrete heat sources was performed numerically. This was an extensive, systematic study where both flush-mounted and protruding sources were considered.