Fracture and Fatigue Behavior at Ambient and Elevated Temperatures of Alumina Bonded with Copper/Niobium/Copper Interlayers

Interfacial fracture toughness and cyclic fatigue‐crack growth properties of joints made from 99.5% pure alumina partially transient liquid‐phase bonded using copper/niobium/copper interlayers have been investigated at both room and elevated temperatures, and assessed in terms of interfacial chemistry and microstructure. The mean interfacial fracture toughness, G c , was found to decrease from 39 to 21 J/m 2 as temperature was raised from 25° to 1000°C, with failure primarily at the alumina/niobium interfaces. At room temperature, cyclic fatigue‐crack propagation occurred both at the niobium/alumina interface and in the alumina adjacent to the interface, with the fatigue threshold, Δ G TH , ranging from 20 to 30 J/m 2 ; the higher threshold values in that range resulted from a predominantly near‐interfacial (alumina) crack path. During both fracture and fatigue failure, residual copper at the interface deformed and remained adhered to both sides of the fracture surface, acting as a ductile second phase, while separation of the niobium/alumina interface appeared relatively brittle in both cases. The observed fracture and fatigue behavior is considered in terms of the respective roles of the presence of ductile copper regions at the interface which provide toughening, extrinsic toughening due to grain bridging during crack propagation in the alumina, and the relative crack propagation resistance of each crack path, including the effects of segregation at the interfaces found by Auger spectroscopy.