Enhancing Stress Intensity Factor Reduction in Cracks Originating from a Circular Hole in a Rectangular Plate under Uniaxial Stress through Piezoelectric Actuation

Circular holes are commonly employed in engineering designs; however, they often serve as locations where cracks initiate and propagate. This paper explores a novel approach to structural repair by utilizing piezoelectric actuators. The primary focus of this study is to investigate the influence of an adhesively bonded piezoelectric actuator patch placed above a circular hole on the stress intensity factor (SIF) in an aluminium plate. The plate is subjected to uniaxial tensile stress, while the piezoelectric actuator is excited with varying voltage levels. The analysis is conducted using the finite element method (FEM), a powerful numerical technique for simulating complex structures. The study assesses the stress distribution and employs the SIF as an adequate criterion for evaluating the impact of different patch configurations. The results indicate a strong correlation between the applied voltage and the SIF. Whether the SIF increases or decreases depends on the polarization of the piezoelectric actuator. Particularly noteworthy is the finding that rectangular patches in a horizontal orientation significantly reduce the SIF compared to other patch geometries. Moreover, double-sided patches exhibit a pronounced decrease in the SIF compared to single-sided patches. In summary, this research underscores the potential of piezoelectric actuators in mitigating stress intensity in structures with circular hole with crack initiation. It offers valuable insights into the influence of applied voltage, patch geometry, and patch placement on the SIF, thereby contributing to developing effective strategies for enhancing structural integrity.