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Dendrimers with Thermally Labile End Groups: An Alternative Approach to Chemically Amplified Resist Materials Designed for Sub-100 nm Lithography — David C. Tully (2000) | RDL Network
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Dendrimers with Thermally Labile End Groups: An Alternative Approach to Chemically Amplified Resist Materials Designed for Sub-100 nm Lithography
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Jean Mj Frechet
University of California, Berkeley
Dendrimers with Thermally Labile End Groups: An Alternative Approach to Chemically Amplified Resist Materials Designed for Sub-100 nm Lithography
Article
2000
en
Authors
DT
David C. Tully
AT
Alexander R. Trimble
Jean Mj Frechet
University of California, Berkeley
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