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Abrasion-resistant bioelectronics based on a three-dimensional topological architecture and covalent chemical anchoring — Yewei Huang (2026) | RDL Network
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Abrasion-resistant bioelectronics based on a three-dimensional topological architecture and covalent chemical anchoring
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Yury Gogotsi
Abrasion-resistant bioelectronics based on a three-dimensional topological architecture and covalent chemical anchoring
Article
2026
en
Authors
+12 more
YH
Yewei Huang
LC
Liangpeng Chen
JL
Jian‐Cheng Lai
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