16x16 SLM with Silicon CMOS Drivers and III-V Modulators
Article 1995 en
Authors
MH
M. Hansen
DS
D.W. Shih
CF
C. Fan
Abstract
1 min read
Hybrid integration of III-V based optical devices, such as modulators, LEDs, and lasers, with silicon VLSI technology promises cost effective solutions to many optoelectronic challenges. It combines the low cost, high density, and high yield of silicon circuitry with the unique optical properties of III-V devices. Flip-chip bonding is a mature and commercial technology. It provides a means of reliable, rapid integration of these two types of devices. 1
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Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
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