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Metallic copper films have been deposited on Si(100) substrates by nebulized spray pyrolysis of Cu(acac), Cu(hfac) and Cu(dpm). The structure and morphology of the films have been examined by x-ray diffraction and scanning electron microscopy. The films are polycrystalline in nature with a preferred (111) orientation. Based on the electrical resistivity data, various transport parameters of the films have been estimated. Growth kinetics and the environmental stability of the films from the precursors have been compared. Taking all the factors into account, Cu(dpm) seems to yield the best films of copper metal.
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An entry from the Cambridge Structural Database, the world’s repository for small molecule crystal structures. The entry contains experimental data from a crystal diffraction study. The deposited dataset for this entry is freely available from the CCDC and typically includes 3D coordinates, cell parameters, space group, experimental conditions and quality measures.